Plating Process Sys. -Since 1980- Repair
& Salvage of Metal Parts, PCB AirCrafts, Vessel, Approved Ind & Mil.
Modification and
repair for Printed Boards and Assombles
1) Epoxy - Under - Conductor(Attached) Method.
2) Adhesive Film Under the Conductor (Attached)
Method.
3) Epoxy - Over - Conductor (Attached) Method.
4) Missing and/or Borken Through
- Holes Eyelet
Repair Method.
5) Surface - Jumper Method.
6) Plating Repair Methods
A COMPLETE SYSTEM
FOR
ECONOMICAL ELECTORONIC REPAIRS
application features:
CONFORMS TO IPC-R-700
B
A PORTABLE SYSTEM;
SAVES DOWNTIME
REMOVES SOLDER SPLASH
DEPOSITS NICKEN, GOLD,
RHODIUN ON FINGER AREAS
CORRECTS VOIDS IN
THRU-HOLE PLATING
REPAIRS CINDUCTOR
LINES ON BARE/ASSEMBLED P.C. BOARDS
IMPROVED SOLDERABILITY
R F SHIELDING
REPAIRS DEFECTIVE
PRECIOUS METAL DEPOSITS
ELECTORONIC INSTALLATION MODEL
030EP
PHOENIX ENGINEERING POWER PACK 1 type
3030PD Phoenix Engineering Power pack; input 110 volts, single
phase, 60 cycles; output 0-30 amps at 0-30 volts,
specially controlled ripple; includes fine
voltage control, special digital ampere-hour meter
with 0.001 amp-hr division and predetermining counter,
reversing switch on-normal-reverse-hi scale-PD indicator
pilot lights, automatic instantaneous safety cut-out switch,
volt-meter, dual range ammeter, leads and plugs